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Designs and developed the first automated direct die mount to lead frame prototype machine for dual-in-line (DIP) packaging. |
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Designed a prototype modular etch station for the tunnel diode assembly line and established a production process using sodium hydroxide etchant. |
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Planned and Implemented the electronic prototype laboratories involving thick film as well as printed circuit board assemblies. |
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Established written processes for die attach equipment, bonding machines cap welders. wet chemistry and wafer processing |
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Trained the electronic assemblers In micro-electronic processes. |
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Prime responsibility to develop a flip-chip process for a solder bumped chip.
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Managed and established on operation plan for design and development of specialized equipment Q.C. procedures and implementation of machinery and special tools for the GE 6F6 jet engine seal repair program. |
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Designed a prototype pendulum grinder to accurately grind a specific arc repeatedly for the jet engine seals.
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Established an electrical and mechanical pre-failure analysis laboratory to analyze the working components of the MK-48 torpedo. Included: buying and installation of equipment |
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Conducted source and failure analysis of PC board inspections to improve vendor processes such as: wire bonds, chip attach, wafer and diffusion anomalies, soldering and gyroscope assembly problems.
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History Page 2
Summary Scope
