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The Selective Solder Machine FE2 The ultimate selective solder machine has a proven [6 Sigma] capability, revealed by a Green/Black belt participation. A study of process history obtained by Statistical Analysis of:
	Preheat nozzles: air velocity, temperature, time & thermocouple control Soldering nozzles: air velocity, soldering profile, repeatability, and thermocouple monitoring Cool down solidifying area: thermocouple monitoring & index control Cool down nozzle [powered]: air velocity, thermocouple monitoring, time & rate Exit time of the Selective Solder Machine:
MODEL FE2
Process – The PC Board assembly is placed in a carrier, placed in the machine and automatically indexes to:
Preheat nozzles; Soldering nozzle; Cool down solidifying area; Powered cool down nozzle; Exit the Machine
Process Control - Accomplished by:
Timers; Thermal-couple; Omega Controllers; Air Control assemblies; Q.C. inspection; Air control assemblies; Nozzle location
Capability - The Selective Soldering Machine is capable of soldering:
Multi-lead components; SMD processors, resistors, capacitors, & SOTs in solder cream; Solder bumped components with flux; Solder Preforms with flux Uses Tin Lead (SnPb) or [Lead Free] (SnAgCu) Solders
SERVICES:	•SMD & Hybrid Fabrication     •PC Board & Circuit Design   •PC Board Assembly •Solder Workshops (SMD & Leaded)      •Written Process & Inspection Procedures