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THE SELECTIVE SOLDER MACHINE
The Selective Solder Machine has demonstrated the capability to give robust solder joints during [SMD] productions of Printed Circuit Boards that:
	Have proven 6 sigma capability Meet IPC-A-610C class 2&3 and military 2000A fillet requirements Display a minimum no-clean flux residue Demonstrate a cycle time of 100-110 seconds Provide a process that stays under 363 degrees. [The reflow temperature of 63 Sn x 37 Pb solder]
Model FE3	Omega Controllers
Design - The Selective Solder Machines were designed to:
Reflow solder multi-lead components & [SMD] components placed in solder creme, solder bumped with flux Use solder preforms or solder washers [with internal flux] on leaded component and 16, 20, 48 pin connectors. Different pin configuration optional. Utilize Tin (Sn) & Lead (Pb) solders and Tin (Sn) & silver (Ag) & Copper (Cu) NEW [Lead Free] solders.
Operation - The Selective Solder Machines is fed a PC Board Assembly, placed in the machine, automatically indexed, and Processes controlled by:
Time controlled pneumatic [Jacob's Ladder] feed mechanism The process requirements Temperature controllers; Preheat station; Solder Station; Cool-down station
SERVICES:	•SMD & Hybrid Fabrication     •PC Board & Circuit Design      •PC Board Assembly     •Solder Workshops (SMD & Leaded)      •Written Process & Inspection Procedures